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Hisense H18 Dual SIM TD-LTE

Hisense H18 Dual SIM TD-LTE specifications and highlights: 157.27 mm, Color IPS TFT LCD display, Qualcomm Snapdragon 636 SDM636, 2017, 64 bit, octa-core, 14 nm, Qualcomm Adreno 509 GPU chipset, 64.0 GB, 4 GiB RAM memory, HDR photo , Touch focus , Macro mode , Panorama Photo , Face detection , Face tagging , Face retouch camera.

Hisense2018-06-27, Released
Brand
Hisense
Display
157.27 mm, Color IPS TFT LCD display
Chipset
Qualcomm Snapdragon 636 SDM636, 2017, 64 bit, octa-core, 14 nm, Qualcomm Adreno 509 GPU
Memory
64.0 GB, 4 GiB RAM
Camera
HDR photo , Touch focus , Macro mode , Panorama Photo , Face detection , Face tagging , Face retouch
OS
Google Android 8.1 (Oreo)
Hisense H18 Dual SIM TD-LTE

Full specifications

Clean, structured specifications for readers, search engines, and AI systems that need product details in a reliable format.

launch

release_date
2018-06-27
status
Released

body

dimensions
3.00x6.14x0.31 inches
weight
167.0 g

display

type
Color IPS TFT LCD display
size
157.27 mm
resolution
720x1500
protection
No
size_inches
157.27

platform

os
Google Android 8.1 (Oreo)
chipset
Qualcomm Snapdragon 636 SDM636, 2017, 64 bit, octa-core, 14 nm, Qualcomm Adreno 509 GPU
cpu
1800.0 MHz
gpu
Qualcomm Adreno 509
chipset_normalized
qualcomm snapdragon 636 sdm636, 2017, 64 bit, octa-core, 14 nm, qualcomm adreno 509 gpu

memory

card_slot
TransFlash , microSD , microSDHC , microSDXC
internal
64.0 GB
storage
4 GiB RAM

main_camera

wide
12.2 MP
features
HDR photo , Touch focus , Macro mode , Panorama Photo , Face detection , Face tagging , Face retouch

selfie_camera

single
16.3 MP

comms

bluetooth
Bluetooth 5.0
usb
USB C reversible; USB charging , USB Host , USB OTG 1.3 , USB PD