Infinix has unveiled a cutting-edge cooling system for mobile devices. The method is based on the liquid cooling technology known as the 3D Vapor Cloud Chamber (3D VCC). increasing the chamber volume by employing a novel design on the dimensionality of the chamber’s shape. By enhancing heat dissipation, the new technology also enhances performance. The China National Intellectual Property Administration has already certified the new technology.
Smaller panels for smartphones will be possible because to the new Infinix 3D VCC cooling technology, which will also enhance performance. For phones with high levels of integration and power, the new method addresses temperature-related problems. It will address a number of issues, including decreased CPU frequency, frozen screens, frame rate reductions, and others. The conventional vapor chamber is significantly outperformed by the innovative Infinix cooling technique. Increases in the evaporator’s volume, water storage capability, and heat flow are made possible by system bumps. With the new technology, capacity gains of up to 20% were made.
The structure’s addition of the bump lengthens the 3D VCC. As a result, thermal conductivity is improved and thermal resistance is decreased. For improved heat dissipation, the thermal resistance of the shield to the vapor chamber is also decreased. The 3D VCC performs 12.5 percent faster than a standard VC in terms of heat dissipation, which results in a lower temperature. A significant accomplishment for the OEM is Infinix’s in-house design of the 3D VCC.
According to Infinix, the new cooling technology will result in VCs that are thinner and have more bumps for improved effectiveness. Additionally, the complete cooling module can be shrunk and the 3D VCC combined with the phone’s core frame into a single component. This could lead to the development of finer cellphones that are also affordable. At present time, there are no discussions on the first gadgets that will use 3D VCC technology.